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Since the application of PS plates to offset printing in the 1960s, the offset printing plate making process has been using pre press techniques such as photosensitive film making, typesetting, plate exposure, and PS plate development. In order to accelerate plate making speed, reduce intermediate links and dot losses, and improve printing quality, some companies in the United States and Japan began to develop CTP (Computer to Plate) systems and plates in the late 1970s, and formed primary products in the 1980s. After entering the 1990s, CTP technology has developed rapidly and is currently in the stage of promotion and application.
| Model | T-800F | T-800S | T-800E | T-400F | T-400S | T-400E |
| Exposing Mothod | External Drum | |||||
| Imaging System | 64-channel | 48-channel | 32-channel | 48-channel | 32-channel | 24-channel |
| Discrete 830nm laser diode | ||||||
| Throughput | 28plates/hour | 22plates/hour | 16plates/hour | 28plates/hour | 22plates/hour | 16plates/hour |
| 1030mm x 800mm, 2400dpi | 800mm x 660mm ,2400dpi | |||||
| Plate Sizes | Max.1163mm x 940mm Min.300mm x 260mm |
Max.800mm x 660mm Min. 260mm x 300mm |
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| Exposing Size | Max.1130mm x 884mm Min.260mm x 284mm |
Max.800mm x 646mm Min. 260mm x 284mm |
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| Media Type | positive 830nm thermal CTP plate | |||||
| Plate Thickness | 0.14mm to 0.30mm | |||||
| Resolution | 2400dpi | |||||
| Repeatablity | ±5μm(continuous exposing for 4times or above on the same plate with a temperature of 23ºC and humidity of 60%) | |||||
| Interface | USB 2.0 | |||||
| Plate Loading | semi automatic | |||||
| Net Weight | 900kg | 800kg | ||||
| Machine Size (WxLxH)mm |
2530x1050x950 | 1900x1200x1000 | ||||
| Power Supply | single phase:220AC,+ 6%,- 10%, power Consumption:4KW | |||||
| Operation Environment |
recommended:21-25ºC, Max.18-26ºC, humidity:40-70% | |||||
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