| Usage: | Offset Printing |
|---|---|
| Plate: | Lithography Printing |
| Type: | CTP Plate Making Machine |
| Material / Metal Processed: | Stainless Steel |
| Classification: | Outside of Drum |
| Light Source: | Semiconductor Laser |
| Customization: |
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Audited Supplier | T-400 Q S Specifications | |||
| Model | S | ||
| Exposing Mothod | External Drum | ||
| Imaging System | 825nm laser | ||
| Throughput |
30plates/hour (max size at 2400 dpi) | ||
| 1030mm x 800mm, 2400dpi, Plate sensitivity 120mj/cm² | |||
| Plate Sizes | Max.800mm x 660mm Min.300mm x 300mm |
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| Plate Thickness | 0.15mm, 0.30mm | ||
| Resolution | Standard: 2400 dpi or 1200 dpi | ||
| Repeatablity | 0.01mm | ||
| Interface | Optical Fiber(Fiberway) | ||
| Plate Loading | Standard: Simplified Autoloader or multi-cassette Autoloader(four cassettes) | ||
| Punching System | Optional: internal punching(maximum four sets of plate holes) | ||
| Machine Size (WxLxH)mm |
1450x1950x1290 | ||
| Power Supply | CTP(single phase:220V, Max power(Peak Value): 4KW) Simplified Autoloader(single phase:220V; Max power(Peak Value): 900W)) Multi-cassette Autoloader(single phase:220V; Max power(Peak Value): 1100W)) |
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| Operation Environment |
recommended:21-25ºC, allowable temperature: 15-30ºC,relative humidity:40-70% | ||
Attention:
Before installation, please measure the thickness of blanket for adjusting the press accurately;
While installation, please use the constant wrench to tighten gradually;
After installation, please clean the rubber surface and ready for print;
During the use, please often use the special solvent to clean the rubber surface for extending the useful time.
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